Kit Gigabyte B560M-DS3H V2+ i5 11600K+ 8Gb RAM3200mhz,. - $440

440 MLC(Transferencia)
Kit Gigabyte B560M-DS3H V2+ Core i5 11600K+ disipador Raijintec JUNO PRO Add+ 8Gb RAM pareja de Corsair Vengeance @3200mhz(2x 4gb). Nuevo a estrenar. Garantía 15 días. Entrega y montaje incluidos.
Otros componentes disponibles.

MOTHERBOARD
Brand GIGABYTE
Model B560M DS3H V2
Supported CPU
CPU Socket Type LGA 1200
CPU Type Supports 11th/10th Gen Intel Core / Pentium / Celeron processors*
* Limited to with 4MB Intel Smart Cache, Intel Celeron G5xx5 family.
Chipsets
Chipset Intel B560
Onboard Video
Onboard Video Chipset Supported only by CPU with integrated graphic
Memory
Number of Memory Slots 4x288pin (DDR4)
Memory Standard DDR4 5333(OC) / DDR4 5133(OC) / DDR4 5000(OC) / 4933(OC) / 4800(OC) / 4700(OC) / 4600(OC) / 4500(OC) / 4400(OC) / 4300(OC) / 4266(OC) / 4133(OC) / 4000(OC) / 3866(OC) / 3800(OC)

CPU
Brand Intel
Processors Type Desktop
Series Core i5 11th Gen
Name Core i5-11600K
Model BX8070811600K
Details
CPU Socket Type LGA 1200
Core Name Rocket Lake
# of Cores 6-Core
# of Threads 12
Operating Frequency 3.9 GHz
Max Turbo Frequency 4.9 GHz
Bus Speed 8 GT/s
L3 Cache 12MB
Manufacturing Tech 14nm
64-Bit Support Yes
Hyper-Threading Support Yes
Memory Types DDR4 2933 / DDR4 3200
Memory Channel 2
Max Memory Size 128 GB
Max Memory Bandwidth 50 GB/s
Virtualization Technology Support Yes
Integrated Graphics Intel UHD Graphics 750
Graphics Base Frequency 350 MHz
Graphics Max Dynamic Frequency 1.3 GHz
PCI Express Revision 4.0
Max Number of PCI Express Lanes 20
Thermal Design Power 125W
Cooling Device Cooling device not included - Processor Only
Windows 11 Supported

RAM
Brand CORSAIR
Series Vengeance LPX
Model CMK16GX4M2B3200C16R
Details
Capacity 16GB (2 x 8GB)
Type 288-Pin PC RAM
Speed DDR4 3200 (PC4 25600)
CAS Latency 16
Timing 16-18-18-36
Voltage 1.35V
Buffered/Registered Unbuffered
Chipset Intel XMP 2.0
Color Red
Heat Spreader Anodized Aluminum
Features
Designed for high-performance overclocking
Designed for great looks
Performance and Compatibility
Low-profile heatspreader design